Forum Topic: International Die & mould Industry Report & Collaborative Development Forum on Forming Supply Chain
Date & Venue: June 3, 2025 | 14:00–17:00
Xinghui Hall, 2nd Floor, Yan’an Hotel, Shanghai, China
Hosts:
Mr. Ryan Huang (President, China Die & Mould Industry Association)
Mr. Li Jianjun (Vice President, China Die & Mould Industry Association)
Keynote Speakers & Topics:
- Mr. Masahito Yamanaka (President, Japan Die & Mould Industry Association)
Topic: “Introduction of Die and Mold industries and current technical developments in Japan”
- Mr. Shin Yong Mun (President, Korea Die & Mould Industry Association)
Topic: “The Current Status and Future Development Strategies of Korea’s Die & Mold Industry”
- Ms.Paggy Zhang (Director of ACCIO Shanghai OfficeZhang)
Topic: “Leveraging Catalonia, Spain, to Unlock New Opportunities in European and Latin American Markets”
- Mr. Yi Ping ( Chairman of EMan Technology)
Topic: “Integrated Digital Solutions for mould & Injection moulding Waste Recycling”
- Mr. Yao Xiaochun (Chairman of VISION TECH)
Topic: “Building a ‘Chain Collaboration System’ in mould Forming”
- Mr. Wang Zhe (Product Director of Beijing FANUC )
Topic: “FANUC Laser Texture Processing Solutions”
Join global industry leaders and experts to explore innovations, strategies, and collaborative opportunities shaping the future of mould technology and supply chains.
Highlights: Cross-border insights, digital transformation trends, and actionable solutions for sustainable growth.
Save the Date!
DMC 2025 | June 4–7, Shanghai New International Expo Centre